Zeyu Yan 燕泽宇
School of Interactive Computing, Georgia Tech
School of Electrical and Computer Engineering, Georgia Tech
Ulu Lāhui Foundation
Postdoctoral Research Fellow | Maker | Car Enthusiast
I am a postdoctoral research fellow at the Hale Ao o Ka Moamoa School of Interactive Computing, with a courtesy appointment in the School of Electrical and Computer Engineering at the Georgia Institute of Technology. I study physical intelligence and fabrication: how digital intelligence can be embodied in physical systems, and how those systems can be fabricated for ease of manufacture, customization, reconfiguration, and sustainability.
I develop embodied intelligent physical systems that enhance perception in XR, expand access to technology for marginalized communities, and support intuitive learning. I also develop accessible, localized manufacturing processes that embed reprogrammability, enabling physical systems to adapt in appearance, form, and function to different needs throughout their lifecycles.
Before joining Georgia Tech, I earned a Ph.D. in Computer Science from the University of Maryland, College Park, where I worked in the Small Artifacts Lab, and an M.S. in Mechanical Engineering from Carnegie Mellon University, where I worked in the Morphing Matter Lab. My work has appeared in leading HCI and computer science venues, including ACM CHI and UIST.
📣 I am actively seeking academic positions in HCI and related fields.
News
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Oct-01-2026
I will join Georgia Tech as a postdoctoral researcher, working with Dr. Josiah Hester and Dr. Omer Inan in a position jointly hired by the School of Interactive Computing (IC) and the School of Electrical and Computer Engineering (ECE).
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Oct-01-2026
I will also join the Ulu Lāhui Foundation as a research consultant, developing computer science education course materials for local high school students.
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Sep-14-2026
DissolvPCB received an Honorable Mention in Fast Company's Student category.
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Aug-17-2026
I will serve as Sustainability Co-Chair for UIST 2026 with Jasmine Lu.
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Aug-09-2026
TherMosaic was accepted to UIST 2026. Congratulations to the team!
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Jul-23-2026
I will serve as an Associate Chair for CHI 2027, supporting its new review format.
Publications